| 摘要 |
PURPOSE:To obviate the defective disconnection due to the contact between wires in the wire bonding step for improving the productivity in relation to the title bonding device and method of semiconductor chip. CONSTITUTION:The title bonding device is provided with a resin solution reservoir 15a storing an insulating region solution 15 in a part of the through hole letting a bonding wire pass through a bonding wire 5 for connecting a bonding pad to the, outer lead of a lead frame on a semiconductor chip to be held by a capillary 11 as well as a hot air blower 16 blowing the part near the end part 11a of the bonding wire drawing-out side of the capillary 11. |
