| 摘要 |
A soldering appearance inspection apparatus is for detecting a faulty soldering at a soldered portion on a printed circuit board. The inspection apparatus includes an illuminating device for illuminating the soldered portion, an image pickup device for picking up an image of the soldered portion, a position detecting device for detecting the position of the soldered portion from the picked up image, and a soldered state judging device for judging an excess or insufficiency of the amount of solder, and also for judging a presence or absence of scorching and luster at the soldered portion, based on a ratio of a region of light subjected to regular reflection on the solder to a size of the soldered portion.
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