| 摘要 |
PURPOSE:To present a method for mounting a semiconductor chip having an inner lead part with array spacing of 100mum or below onto a film carrier with ease and high reliability. CONSTITUTION:This method comprises a step for bonding a metal bump 13, which is to be passed through a film carrier 5, by thermocompression onto an electrode 11 of a semiconductor chip 1, a step for inserting the metal bump 13 into a through hole 52 made through the base film 51 of the film carrier 5, and a step for bonding the top of the metal bump 13, which has passed through the through hole 52, by thermocompression onto each inner lead part 54 located at one or both sides of the through hole 52 on the film carrier 5. In this way, these steps constitute a method for mounting the semiconductor chip 1 on the film carrier 5 having no device hole. |
