MANUFACTURE OF SEMICONDUCTOR DEVICE AND METALLIC MOLD APPLICABLE THERETO

摘要

PURPOSE:To exhaust the stagnant air between a tablet resin and a pot for reducing the defectives due to void in relation to the manufacture of the title semiconductor device using a transfer mold. CONSTITUTION:The parts excluding the bottom metallic mold 1b are heated at the higher temperature than that of the bottom metallic mold 1b by heating means 11, 13a. Next, tablet resin 10 is inserted to be thermally platicized from the top. Lastly, cavities 4a, 4b are filled up with resin 12a, 12b by pressurizing the resin with a plunger 7.