| 摘要 |
PURPOSE:To enhance reliability between interlayer connection by platstically deforming a thermoplastic resin layer during heating pressure forming in order to carry out circuit pattern interlayer connections and bending work for a multilayer printed wiring board thus formed when forming said thermoplastic resin layer with the application of heat and pressure. CONSTITUTION:Thermoplastic resin films 1a and 1b are sequentially positioned and doubled into a laminated body 1, which is applied to a heating/pressurizing molding machine provided with molds 4a and 4b wherein opposed surface are projected and recessed, thereby molding with heat and pressure. When carrying out the heating/pressurizing molding operation, each of the thermoplastic resin films 1a and 1b, which are turned in to the laminated body 1 is deformed based on their respective thermoplasticity, thereby connecting the layers between specified circuit patterns 3a and 3b and integrated into one piece. This construction makes it possible to hold connection between the high reliability layers 3a and 3b. |
