| 摘要 |
PURPOSE:To reduce the number of parts and simplify a manufacturing process by mounting a chip, a connector and a jumper line on a printed wiring board with a surface packaging technique to charge it in a mold for injection-molding thermoplastic resin. CONSTITUTION:A chip 7 is mounted at a preset position on a printed wiring board 5 on which an electric circuit pattern 6 is printed, and a connector 4 connected to an outside harness and a terminal connected to a jumper line, if necessary, are previously mounted on a printed wiring board 2. This temporarily connected printed wiring board 2 is set in a mold 11 and put in press contact with the jumper line 3 pressed by the mold 11 via a press-contact terminal 8. Since then, melted resin is injected therein from an injection gate 12 to manufacture a plastic meter case. |
