发明名称 MULTILAYER LAMINATE
摘要 <p>PURPOSE: To provide a multilayer laminate containing a polyamide-polyimide block copolymer as a base. CONSTITUTION: The multilayer laminate comprises at least two meal foils such as, for example, copper foils directly bonded by a polymer layer made of a polyamide-polyimide block copolymer. The laminate is flexible, non-sticky, and is useful as an electronic engineering circuit board.</p>
申请公布号 JPH04251737(A) 申请公布日期 1992.09.08
申请号 JP19910216349 申请日期 1991.08.02
申请人 CIBA GEIGY AG 发明人 RUDORUFU PUFUAENDONAA;TOOMASU KAINMIYURAA;BUORUFUGANGU SHIYARUFU;TEOBARUTO HOIKU;YOSEFU PUFUEIFUAA;HERUMAN DEIITERUMU
分类号 B32B15/088;B32B7/12;B32B27/34;B32B37/24;H05K1/03 主分类号 B32B15/088
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