| 摘要 |
PURPOSE:To perform a wire bonding operation stably, to sharply enhance the yield of a wire bonding process and to enhance the reliability of a semiconductor device by a method wherein a part whose lead width is widest is selected within a preset bonding range at inner leads is selected and the part is wire-bonded. CONSTITUTION:Light is irradiated form a lamp 2 at the upper part of a lead frame 1 placed on a heater plate 9; the picture of inner leads 8 fixed by using a lead-frame weight 5 is taken by using a CCD camera 3 at the upper part; its image is processed at a bonding-position control part 6; the central part in a position whose lead width is widest within a preset bonding range 12 is computed; a bonding tool 4 is move by using a tool drive part 15 on the basis of its information; a wire bonding operation is performed. Since the bonding position of a bonding wire 11 is situated in the central part of the part whose inner lead with is widest, a stable wire bonding operation can be performed. |
