| 摘要 |
<p>PURPOSE:To obtain the title composition suitable for a wide range use such as solder resist, etching resist, plating resist, etc., having excellent curing properties, water resistance and solvent resistance, comprising a specific energy ray- curing resin and a photopolymerization initiator. CONSTITUTION:The objective composition comprising (A) an energy ray-curing resin shown by formula I [X is 0 or CH2; R is H or methyl; Y is group shown by formula II (R1 is H or methyl; R2 is H, methyl, cyano or halogen; B1 is residue of polybasic acid anhydride); Z is group shown by formula III or formula IV] and (B) a photopolymerization initiator such as a benzoin (alkyl ether), an acetophenone or an anthraquinone. The component A is obtained by reacting a reaction product of a polyfunctional epoxy compound and an unsaturated monocarboxylic acid with a compound selected from an aromatic, an aliphatic and/or an alicyclic polybasic acid anhydrides.</p> |
