| 发明名称 |
Semiconductor chip protection layer and protected chip |
| 摘要 |
Semiconductor chips are protected from handling damage by formation of a polymer dielectric layer at least 2 microns thick on the chip surface before dicing or shortly after dicing. The polymer dielectric layer may be a thermoplastic material or a thermoset material.
|
| 申请公布号 |
US5144407(A) |
申请公布日期 |
1992.09.01 |
| 申请号 |
US19900561216 |
申请日期 |
1990.07.31 |
| 申请人 |
GENERAL ELECTRIC COMPANY |
发明人 |
WOJNAROWSKI, ROBERT J.;EICHELBERGER, CHARLES W. |
| 分类号 |
H01L23/29;H01L23/31 |
主分类号 |
H01L23/29 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
