| 摘要 |
PURPOSE:To realize solder bonding with high reliability between solder bumps of a semiconductor flip chip and lands of a printed wiring pattern on a printed wiring board. CONSTITUTION:Upon heating the top face of a flip chip 3 mounted on a printed wiring board 2, the position of a laser spot 11b formed on the top face 3b of the above-mentioned chip for solder bonding between solder bumps 6 and lands 5 is moved according to the tilt of the top face of this chip so that the printed wiring board may be almost parallel with a flip chip after the solder bonding is completed. |
