发明名称 THICK FILM RESISTOR FORMATION METHOD
摘要 <p>PURPOSE:To reduce value deviations in thick film resistors and make improvement of product yield possible by screen printing a resistor paste film and drying this resistor paste film, and then using screen printing to layer another resistor paste film on top of the former. CONSTITUTION:Electrode films 2 and 3 formed in a pair on the top surface of a substrate 1, and a resistor paste film 4 is formed so as to extend between the electrode film pair 2 and 3 by screen printing. Next, the substrate 1 is carried through a dryer oven, etc., and the resistor film paste 4 is dried. Then, screen printing is done on top of the resistor paste 4 of the substrate 1 so that a resistor film paste film 5 is formed. As a result, since the concave sections of the rough areas of the surface of the bottom layer resistor paste film 4 are filled by the top layer resistor paste, the deviations in the film thickness of the bottom layer resistor paste 4 are corrected and minimized.</p>
申请公布号 JPH04243103(A) 申请公布日期 1992.08.31
申请号 JP19910003930 申请日期 1991.01.17
申请人 MURATA MFG CO LTD 发明人 AZUMA SHIGEKI
分类号 H01C17/06 主分类号 H01C17/06
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