SOLDER PADS, METHODS, AND SYSTEMS FOR CIRCUITRY COMPONENTS

摘要

Solder pads, systems, and related methods are provided. A first or second pad include at least one shape for increasing a number of edges available to align at least one part to be soldered thereto. Each solder pad can occupy a same surface area of the substrate. A plurality of circuit elements can be provided over the plurality of solder pads, where some of the circuit elements occupy different surface areas of the substrate and/or the solder pad. A method of providing a solder pad includes providing a substrate, providing a solder pad over the substrate, and providing at least one shape in the solder pad for increasing a number of edges available to align at least one part to be soldered thereto. The pads can attach for example to a surface-mount ceramic component, a submount-free component, a leadframe component and/or a chip on board component.

主权项

1. A solder pad for attaching to a plurality of different parts, the solder pad comprising:
a first pad; and a second pad separated from the first pad by a gap; wherein the first or the second pad comprises at least one shape for increasing a number of edges available to align at least one part to be soldered thereto.