| 摘要 |
<p>PURPOSE:To provide a semiconductor device using a novel ceramic board in which a patterning accuracy and stability of wire bonding can be remarkably increased. CONSTITUTION:A semiconductor device using a ceramic board characterized in that a polyimide film 9 is formed on an entire region except a die attachment and a wiring bonding region 2 on a ceramic board 8, a Cu or Al film is formed thereon by a vapor method, and it is then pattern-etched.</p> |
