发明名称 FILLING METHOD OF VIA OF THROUGH-HOLE
摘要 PURPOSE:To prevent insufficient conduction and to lower costs by filling conductive paste using a squeegee in a through-hole of a green sheet which is prevented from deforming by lining with a porous sheet. CONSTITUTION:A porous sheet 3 is laminated on the rear side of a green sheet 2 with a through hole 1 to prevent deformation of the sheet 2. A porous sheet or a sheet formed by meshing fibers such as nylon is used as the sheet 3. The green sheet 2 is set to a print stage 5 and a screen 6 with a hole in a position corresponding to the through-hole 1 is laminated. A squeegee 7 is moved at a fixed speed on the screen 6 in arrow direction while carrying conductor paste 4 to charge the conductor paste 4 in the through hole 1. The sheet 3 removes excessive air inside the through hole 1 and prevents the conductor paste 4 from creeping and attaching. Thereby, it is possible to prevent insufficient conduction in vertical direction and to reduce costs.
申请公布号 JPH04239193(A) 申请公布日期 1992.08.27
申请号 JP19910002435 申请日期 1991.01.14
申请人 NEC CORP 发明人 ONO KAZUHIKO
分类号 H05K3/40;H05K3/46 主分类号 H05K3/40
代理机构 代理人
主权项
地址