Multilayer wiring structure and method for forming multilayer construction.

摘要

Low-thermal-expansivity polyimides have a linear rigid skeleton, so that adhesion between perfectly cured low-thermal-expansivity polyimide films is very low. On the other hand, a film of a polyimide (2, 4, 6) having a flexible skeleton shows high adhesiveness even after perfect curing, so that it is possible to enhance adhesion between the low-thermal-expansivity polyimide films (3, 7) by interposing a polyimide having a flexible skeleton. A flexible polyimide thin film (2, 4, 6) is formed as a highly adhesive film on a low-thermal-expansivity polyimide film (3, 7) n a half-cured state, then metallic wiring (5) is applied thereon, followed by formation of another highly adhesive thin film (2, 4, 6) in a half-cured state, and then a low-thermal-expansivity polyimide film (3, 7) is further formed thereon. It is possible to provide a multilayer wiring structure which has improved adhesion between the low-thermal-expansivity polyimide film (3, 7) and the wiring pattern layer (5) or the substrate.