OUTER-LEAD SHAPING APPARATUS OF RESIN-SEALED SEMICONDUCTOR DEVICE,申请号JP19910019429-传众专利搜索

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发明名称	OUTER-LEAD SHAPING APPARATUS OF RESIN-SEALED SEMICONDUCTOR DEVICE
摘要
申请公布号	JPH04236455(A)	申请公布日期	1992.08.25
申请号	JP19910019429	申请日期	1991.01.18
申请人	YAMADA SEISAKUSHIYO:KK	发明人	FUJIWARA KAZUO
分类号	H01L23/50	主分类号	H01L23/50
代理机构		代理人
主权项
地址

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