MULTIPLE LAMINATED HIGH-DENSITY INTER- CONNECTION STRUCTURE, METHOD FOR ITS MANUFACTURE

摘要

PURPOSE: To provide a method for forming a dielectric upper layer in a high- density mutually connecting structure, while avoiding the coating of solvent and the baking of a dielectric layer, and the structure. CONSTITUTION: A high density mutually connecting structure in which a plurality of laminated dielectric layers are built is manufactured by using a thermoplastic adhesive agent. Each of the dielectric layers consists of an upper layer and a lower layer, which is composed of the thermoplastic adhesive agent. The glass transition temperature of the lower layer of each dielectric layer becomes lower successively from the lower layer which is adjacent to a board toward the upper layer. Thereby the stability of the formed structure can be ensured, when a laminate is newly stacked.