发明名称 METHOD AND DEVICE FOR SELECTIVELY REMOVING METALLIC THIN FILM OF METALLIZED FILM
摘要 <p>PURPOSE:To selectively remove the metallic thin film by irradiating the laser beam on the metallized film running while being wound on the rotating metallic drum. CONSTITUTION:The metallic thin film is removed selectively by winding the metallized film 7a whose thin film surface is made to the outer side on the circular column like metallic drum 1 having the roughness <=0.4S of the front surface and being rotationable, and irradiating the laser beam 8 while running to the metallized film 7a running on the drum. Therefore, for example, the metallized film of the thickness <=1.2mum being set the non-metallic belt of extra fine width <=0.2mm width which is required for manufacturing the extra small size film capacitor can be easily manufactured.</p>
申请公布号 JPH04231185(A) 申请公布日期 1992.08.20
申请号 JP19900408695 申请日期 1990.12.28
申请人 TORAY IND INC 发明人 SUZUKI MOTOYUKI;DEGUCHI YUKICHI
分类号 B23K26/00;B32B37/00;H01G4/18;H01G13/06 主分类号 B23K26/00
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