摘要 |
<p>PURPOSE:To reduce the heat conduction from a heating part to a thermometric resistor and to prevent the adhesion of dust to the utmost by forming a slit part between the heating part and the thermometric resistor along the longitudinal direction thereof. CONSTITUTION:A thin-walled diaphragm part 23 is formed to the surface of a semiconductor substrate 21 and a heater 7 is formed thereon and thermometric resistors 8, 9 are formed on both sides of the heater 7 and, further, slit parts 24l, 24r are provided on both sides of the heater 7. Since the heat conduction from the heater 7 to the resistors 8, 9 through the member of the diaphragm part 23 is reduced by this constitution, the temp. rise of the resistors 8, 9 becomes low as compared with conventional resistors. Therefore, the output error due to the adhesion of dust becoming large in proportion to the temps. of the resistors 8, 9 and the output error due to the drift of the TCR mismatching between the upstream resistor 8 and the downstream resistor 9 becomes small. Further, since air does not enter the space part under the diaphragm part 23 and flows along the surface of the diaphragm part, the adhesion of dust becomes min.</p> |