CAVITY-UP-CAVITY-DOWN MULTICHIP INTEGRATED CIRCUIT PACKAGE,申请号KR19880071572-传众专利搜索

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发明名称	CAVITY-UP-CAVITY-DOWN MULTICHIP INTEGRATED CIRCUIT PACKAGE
摘要
申请公布号	KR920006748(B1)	申请公布日期	1992.08.17
申请号	KR19880071572	申请日期	1988.11.30
申请人	UNISYS CORP.	发明人	TUSTANIWSKYJ, JERRY I.
分类号	H01L23/04;H01L25/04;(IPC1-7):H01L23/04	主分类号	H01L23/04
代理机构		代理人
主权项
地址

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