| 摘要 |
<p>PURPOSE:To accurately measure a temperature in a package without influence of a contact resistance between a lead terminal of an IC package and a contactor or a current leakage by measuring the temperature in the package by using a temperature sensor sealed in the package. CONSTITUTION:A temperature detector 10, a converter 14 for converting a temperature detection output into a digital measured value, a correction value memory for storing a correction value for the output of the converter 14, and a calculator 16 for correcting the measured value based on the correction value and introducing it out of the package, are provided. A power source intermittent controller 3b for intermittently supplying power by an external command is provided on a semiconductor chip, and a temperature rise is eliminated by a measured power as much as possible.</p> |
