| 摘要 |
PURPOSE:To unnecessitate the formation and retention of a plurality of kinds of master slices and to cut down the cost of production by forming a wiring using the exposure size different from the first photomask, to be used in the fundamental process, and the second photomask for layout. CONSTITUTION:A circuit part, wherein fundamental circuit elements 1 are laid over the whole surface using the photomask A for basic process, and a dedicated part, with which a wafer positioning marks 2 are arranged, are provided. On the other hand, a scribe lane 4 is provided on the circumference of chips 3 using the photomask B for a wiring process, and the wafer positioning mark 5 for wiring process is arranged on the scribe lane 4. The scribe lane and the positioning mark of the wiring process are formed on the circuit element of the basic process the wiring process. |
