| 摘要 |
PURPOSE:To prevent a bonding wire from being swept off when a semiconductor device is sealed up with resin by a method wherein the bonding wire is bonded so as to enable a part of the bonding wire to be fixed as buried in the wire fixing resin, and then the semiconductor device is sealed up with resin. CONSTITUTION:A resin fixing plane 3 recessed lower than an island 1 and inner leads 2 is provided surrounding the island 1, and silicone resin high in thixotropy is provided to the resin fixing plane 3 as a bonding wire fixing resin 5 through potting. Then, when a semiconductor pellet 6 on the island 1 is connected to the tips of the inner leads 2, a bonding operation is carried out as a part of a bonding wire 4 is kept buried in the bonding wire fixing resin 5, and a semiconductor device is sealed up with resin. By this setup, a bonding wire can be prevented from being swept away when a semiconductor device is sealed up with resin. |
