| 摘要 |
PURPOSE:To correctly perform a wire bonding operation by a method wherein, in a state that an island is pressed directly by a fixation member, a prescribed wire bonding operation is performed between an IC chip or the like mounted on the island and an inner lead. CONSTITUTION:When a wire bonding operation is performed to a lead frame 10, individual leads 13 are pressed at their base parts from the upper part by using a fixation member 14, and an island 11 is pressed at its side edges in regions of suspension leads 12 from the upper part by using a fixation member 15. Thereby, the island 11 and the individual inner leads 13 can be fixed surely in their prescribed positions. When the lead frame 10 is constituted in this manner and a bonding component 17 such as a capillary or the like provided with a ball 17a for bonding is brought between an IC chip 16 mounted on the island 11 and the individual leads 13, a required wire bonding operation can be performed.
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