| 摘要 |
PURPOSE:To avoid the increase in the chip space by a method wherein a frame is impressed with a current potential or any signal potential while the space between the position on the semiconductor chip required of a power supply potential or any signal potential and the frame is wired using single or multiple bonding wires. CONSTITUTION:Within the title semiconductor device structured of a semiconductor chip 2 to be die-bonded onto a frame 1, the semiconductor chip 2 is die-bonded onto the frame 1 through the intermediary of an insulating junction material while the frame 1 is impressed with a power supply potential or any signal potential and then the space between the position on the semiconductor chip 2 required of the power supply potential or any signal potential and the frame 1 is wired using single or multiple bonding wires so that the power supply or any signal line provided on the semiconductor chip 2 may be eliminated thereby enabling the increase in the chip space to be avoided. At this time, a lead 7 not disconnected from the frame 1 is impressed with the same power supply potential or the signal potential. In such a constitution, the frame 1 and the semiconductor chip 2 are bonded each other through the intermediary of a junction material 12 so that the substrate potential of the semiconductor chip 2 may not be affected by the potential of the frame 1. |
