LIGHTING METHOD FOR ELECTRONICS PARTS ASSEMBLY STATE TESTING

摘要

The lighting method is used for detecting the bending state of lead in inspecting electronic parts mounted on PCB. The method is composed of sequential lighting by adjacent three pairs of LED units, catching the image of lead (3) by a camera provided at the rear of middle LED unit, and inspecting the bending state of the lead (3) in front/rear or left/right or diagonal directions.