| 摘要 |
PURPOSE:To obtain an enough clamping force so as to a prevent resin from leaking out from a sealing die by a method wherein a square or a round protrusion is provided to the surface of a heat dissipating plate, and a square or round recess is provided to the center of the protrusion concerned. CONSTITUTION:A bonding pad provided to a semiconductor device 1 is connected to a lead 4 with a wire 2. The semiconductor device 1, a part of the lead 4, and a part of a heat dissipating plate 5 are bonded to an insulating plate 3 with adhesive agent and sealed up with a resin 6. The heat dissipating plate 5 is formed protrudent and provided with an outer step 20mum or above in height, and a recess 20mum in depth is provided to the center of the dissipating plate 5. The heat dissipating plate 5 is supported by the insulating plate 3 and the lead 4, and the surface of the heat dissipating plate 5 is pressed against a sealing die. At this point, as only the protrudent part of the heat dissipating plate 5 comes into contact with the sealing die, the contact surface of the dissipating plate 5 with the sealing die is small in area, in result an enough clamping force can be obtained. By this setup, a clamping force can be obtained enough at sealing, so that the leakage of resin can be lessened. |
