| 摘要 |
<p>PURPOSE:To prevent contact of neighboring wires while coping with multi-pin requirment by providing a two-stage inner lead construction. CONSTITUTION:A second stage inner lead 14 is provided on the upper part between both centers of the neighboring first stage inner leads 13. The second stage inner lead 14 has the longer distance from a die pad 12 than the first stage inner lead 13. Then, at a place, the inner leads 13, 14 of the first and second stages have sufficiently long distances from the die pad 12, the width is made into a narrow shape and the second stage inner lead 14 is put from the narrowed part between the neighboring first inner leads 13 so as to equalize the first and second inner leads 13, 14 n height. Thereby, the problems of multi- pin of semiconductor IC and contact of wires can be sufficiently resolved.</p> |
