Use of reactive substrate in thick film resistor mfr. - has thick dielectric layer acting as adhesion promoter and insulating layer, between resistor layer and substrate

摘要

Layered devices with conductor and resistor layers in thick film technology are made on substrates of pref. Y-Fe-garnet, ferrite or AlN. The feature is that a dielectric layer, which acts as adhesion promoter and insulating layer, is provided between the resistor layer and the substrate. In the pref. process the dielectric layer is first printed and fired, then the conductor layer is printed and fired, and possibly additional layers individually fired, and finally the resistor layer is printed and fired, pref. as a paste compatible with a conductor layer using Cu, Ag, Ag/Pd or Au/Pd. A final coating layer can be deposited and/or a noble metal layer applied. USE/ADVANTAGE - The intermediate dielectric layer allows resistor layers to be used which would react with the substrate material in the absence of the layer, either during firing or during laser trimming.