| 摘要 |
<p>PURPOSE:To reduce the input capacity by a method wherein part of circuit components are manufactured per respective packages and then the circuit components to be useless are cut down after the decision of the package containing chips. CONSTITUTION:Part 6, 7a, 7b out of circuit components are manufactured per respective packages and then these circuit components or signal wirings are diced as if traversing themselves so as to cut down the circuit components to be useless after the decision of the package containing chips. That is, a chip for SOJ cuts off the pad 6 for ZIP along a dicing line 8c while a chip for ZIP cuts off pads for 7a, 7b along dicing lines 8a, 8b. At this time, respective signals are provided with transfer circuits so that an inner circuit (a) may not be unfavorably affected by the cut off side circuits. These transfer circuits are actuated by selecting either one out of the SOJ signal or the ZIP signal for cutting off the other one depending the impression of Vcc upon either one pad out of 4a or 4b. Through these procedures, the title semiconductor memory in small input capacity can be manufactured.</p> |
