| 摘要 |
<p>PURPOSE:To contrive an improvement in operatability by a method wherein, before a wafer seat is extended at a take-up stage, it is previously preheated at a preheat stage. CONSTITUTION:By a heat wind blowing up from a heat pipe 32 of a preheat stage 3, a wafer seat 9 of a wafer ring 8 is heated. A chip 10 of a beforehand ring 8 is transferred to a substrate and mounted thereto. When a chip 10 of a take-up stage 2 is not present, the ring 8 is conveyed till a returning guide 23. Next, a cylinder 28 is driven so that a going guide 22 may be so set as to be the same height as a holder 41 of the stage 2. The ring 8 heated at a preheat stage 3 is conveyed to the stage 2 and the ring 8 conveyed till the returning guide 23 is withdrawn into a magazine 1. A motor 48 is driven to descend a pushing board 43, so that the seat 9 is pushed against a receiving ring 42 and extended, whereby a take-up of the chip 10 on the seat 9 is restarted.</p> |
