| 发明名称 |
THIN FILM MULTILAYER CIRCUIT AND METHOD OF MAKING THIN FILM MULTILAYER CIRCUITS |
| 摘要 |
The invention relates to a thin-film multilayer circuit which consists of at least one layer sequence comprising a plurality of conductor track layers with intervening organic polymer insulation layers, which layer sequence is deposited on a substrate, and also to a method of making such thin-film multilayer circuits with a polyimide base. The invention is characterised in that aluminium nitride, silicon nitride or metal, preferably copper/molybdenum (CuMo), is provided as substrate. <IMAGE> |
| 申请公布号 |
EP0474176(A3) |
申请公布日期 |
1992.07.15 |
| 申请号 |
EP19910114818 |
申请日期 |
1991.09.03 |
| 申请人 |
TELEFUNKEN SYSTEMTECHNIK GMBH |
发明人 |
FEURER, ERNST, DR.;JARNEY, GUENTHER;HOLL, BRUNO, DR.;SCHMIDT, DIETER |
| 分类号 |
H01L21/48;H01L23/14;H01L23/15;H01L23/498;H01L23/538;H05K1/03;H05K1/05;H05K1/09;H05K3/10;H05K3/38;H05K3/42;H05K3/46;(IPC1-7):H01L23/498 |
主分类号 |
H01L21/48 |
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