| 摘要 |
<p>PURPOSE:To improve yield by effecting a high density mounting of flip chips having high pin density, by a method wherein a mold release sheet having the low coefficient of friction is put between the surface of a green sheet laminated body and an interface of a laminating jig and the green sheet laminated body is pressure-contacted. CONSTITUTION:A laminated body 5 obtained by laminating green sheets is placed between intermediate plates of metallic plates having a thickness of about 1mm to pressure-contact the laminated body by arranging mold release sheets 6 having the low coefficient of friction on both sides of the laminated body 5. Then the outsides of the intermediate plates 4 are placed between laminated jig paltes 2 through 'Mylar(R)' films and performs hot pressing to make disjoint of a jig tool easy and avoid contacting between metals. A pressure distribution on the green sheet laminated body can be loaded evenly by only pressure-contacting by inserting the mold release sheet 6 having the low coefficient of friction like this. With this constitution, since the pressure-contacted green sheet laminated body 5 is made into uniform laminated density and performs isotropic contraction at the time of sintering, a multi-layer ceramic board having high positional accuracy can be obtained.</p> |
