| 摘要 |
PURPOSE:To prevent the scattering of resist on the outer circumference of a semiconductor, and to make it possible to apply the resist uniformly by a method wherein the position of a nozzle is detected and the resist is dripped while the rotational speed of the semiconductor substrate is being controlled. CONSTITUTION:A semiconductor substrate 1 is fixed by sucking to a chuck 2, it is rotated by a rotary motor 3, and a nozzle 4 is moved in radial direction on the substrate by a ball screw 9 and a nozzle moving motor 5. The position of the nozzle 4 is detected by the nozzle position detecting sensor 6 of the rotary encoder and the like coupled to the motor 5. The signal sent from the sensor 6 is treated by a rotation control unit 7, and the substrate 1 is coated with a resist by controlling a motor power source 8 in such a manner that the relative speed of the substrate 1 and the nozzle 4 is being kept constant. As a result, the scattering of the resist dripped on the outer circumference of the substrate can be prevented, and a uniform film is obtained. |
