| 摘要 |
PURPOSE:To prevent the excessive adhesion in soldering or bridge inferiority by flow up by selectively leaving hole stopping ink inside a T/H exclusively used for continuity. CONSTITUTION:An insulating board 1 lined with copper is plated with a conductor 2, and a through hole is made, and then the through hole is filled up with hardening hole stopping ink 3, and then it is hardened. Next, a circuit pattern is printed with an etching resist 4, and then etching treatment by cupric chloride solution or the like to get a conductor circuit 2b. Furthermore, only the etching resist 4 is selectively exfoliated and removed by aqueous sodium hydroxide, and then photosensitive SR ink 5 is applied on the insulating substrate 1 by screen coating method, and then it is dried. After this, using a mask film, ultraviolet rays are applied selectively to the T/H 2a part exclusively used for continuity, etc., and further with an organic solvent, the photosensitive SR ink 5 at the unexposed part and the thermosetting hole stopping ink 3 are dissolved and removed to get a printed wiring board. |
