首页
产品
黄页
商标
征信
会员服务
注册
登录
全部
|
企业名
|
法人/股东/高管
|
品牌/产品
|
地址
|
经营范围
发明名称
SEMICONDUCTOR SEALING MOLD
摘要
申请公布号
JPH04186740(A)
申请公布日期
1992.07.03
申请号
JP19900317236
申请日期
1990.11.20
申请人
MATSUSHITA ELECTRIC IND CO LTD
发明人
ABE MITSUHIRO;OKUBO NAOYUKI;TANAKA TAKAHIRO
分类号
H01L21/56
主分类号
H01L21/56
代理机构
代理人
主权项
地址
您可能感兴趣的专利
NONVOLATILE SEMICONDUCTOR MEMORY DEVICE
Decoys for infra-red radiation seeking missiles and methods of producing and using the same
STRUTTURA AUTOPORTANTE PER SOLAI
Improved interpolation of video compression frames
Testing method for bolts
Optical fiber cable and method of mid-span access thereof
Tapered joint for vehicle suspension components
Flip open package with tiered compartments
Method and apparatus for substance identification
Skin care compositions and related methods
System for automated excavation contour control
Antibody-dependent cellular cytotoxicity assay
One-way injector with continuously charged spring energy store
Process for manufacturing micromechanical devices containing a getter material and devices so manufactured
Integrated top drive and coiled tubing injector
Device for the hot-dip coating of a metal strip
Synchronous one-bit interface protocol or data structure
Reproductive cell system
Cutting segment for cutting tool and cutting tools
An Improved Skylight Panel
