Method and apparatus for solder leveling of printed circuit boards.

摘要

Disclosed is a method and apparatus for fabricating workpieces such as printed circuit boards (10) which include blowing excess solder off the board by a hot air solder leveling technique. A converging/diverging airknife design (32) creates a shock wave, causing a high pressure, low velocity flow pattern which removes solder from the through-holes (13) in the board while leaving sufficient solder on the surface mount features (11).