| 摘要 |
PURPOSE:To enable the front ends of inner leads to be closely bonded onto a support jig even if the flatness in the front ends of the inner leads is varied by a method wherein the support jig of inner leads takes a gradient shape toward a semiconductor mounting part while a trench is made in the part corresponding to a press jig pressing down the inner leads. CONSTITUTION:Within the title semiconductor device manufacturing system wherein a semiconductor element 1 and the inner leads 3 of a lead frame are connected by wires 2, the support jig part 5 for mounting the inner leads 3 takes a gradient shape toward a semiconductor element mounting part while a frame type trench 6 is made in the part of the support jig 6 corresponding to a press jig 4 fixing the inner lead parts downward. Through these procedures, even if the flatness in the front ends of the inner leads 3 is varied, any strain can be absorbed by the press jig 4 and the support jig 5 thereby enabling the front ends of the inner leads 3 to be closely bonded onto the gradient surface of the support jig 5. Furthermore, since the wires 2 are apt to be cut off at the end parts when they are to be cut off by pulling up, the bonded wires are hardly separated from the inner leads 3. |
