MOLDING DEVICE FOR SEALING SEMICONDUCTOR ELEMENT WITH RESIN

摘要

A reference pin (150) is provided on a bottom die (108) of a molding device (100). A lead frame (3) is carried with a chucking device (120) attached to an X-Y table mechanism (110). A hole (132) is formed in a stage (131) of the X-Y table mechanism. Respective images of the hole and the pin are detected by a TV camera (142) to control the relative position of the bottom die and the lead frame by driving the X-Y stage.