ANORDNUNG ZUR DURCHFUEHRUNG EINES AUSHEILPROZESSES AN EINER HALBLEITERSCHEIBE UND VERFAHREN ZUM AUSHEILEN EINER HALBLEITERSCHEIBE.

摘要

(A) A semiconductor wafer healing system includes a wafer (1)-receiving reaction tube (2) having a gas inlet and outlet (7), a heater (3) for heating the tube to a base temp. and a heater (4) for selectively heating the wafer (1) to the healing temp. (B) A wafer healing process comprises (a) inserting a wafer (1) in a reaction tube (2); (b) connecting the reaction tube (2) to a regulatable gas supply system, sealing and filling with inert gas; (c) heating the reaction tube wall to a base temp. high enough to avoid condensation of any evapd. material but low enough to avoid initiation of the healing process; (d) selectively heating the wafer (1) to the healing temp. for a few secs.; and (e) cooling the appts. to room temp. and removing the wafer.