发明名称 METHOD OF CURING THERMOSETTING EPOXY RESIN
摘要 PURPOSE:To lessen residual stresses and thus eliminate partially recessed grooves and other appearance defects by curing liquids epoxy resin, at this time, raising the temperature successively or stepwise from the time of gelation, and after reacting a predetermined temperature, curing it at a constant temperature. CONSTITUTION:For example, epoxy resin is heated at a furnace temperature of 100 deg.C-110 deg.C for 5-9 hours, and at the time of gelation and thereby proceeding with shrinkage, the furnace temperature is raised by 5 deg.C and held at this state for two hours. This procedure is repeated successively, and after reached to the final curing temperature of 120 deg.C-130 deg.C, it is held at the final curing temperature for 20 hours or more, thus completing the curing reaction entirely.
申请公布号 JPH04168005(A) 申请公布日期 1992.06.16
申请号 JP19900294426 申请日期 1990.10.31
申请人 HITACHI CABLE LTD 发明人 KATO YUJIRO;IDE SHIGEO;SUZUKI KAZUO;KAJIMA SHUNEI
分类号 B29C35/02;B29K63/00;B29L31/34;C08J3/24 主分类号 B29C35/02
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