发明名称 MOLDING METHOD FOR PAD MATERIAL INTEGRAL WITH SKIN MATERIAL
摘要 PURPOSE:To remove the occurrence of the position-deviation of the terminals of skin material or the warpage thereof, while the raw liquid of foaming synthetic resin does not leak from the opening of the skin material by a method in which a pair of wires are respectively inserted inside of both terminals opposite to the opening of the skin material, and both terminals of the skin material are stuck to each other by the elastic force of a pair of wires. CONSTITUTION:Skin material 15 is preliminarily formed in the state where a prescribed opening 17 is provided. The skin material 15 is arranged in the state where the left and right molds 22, 23 of a foaming mold 21 are opened, and a frame 12 is inserted into the inside of the skin material 15. Elastic wires 25, 26 are inserted into the inside of a pair of up and down terminals 17a, 17b of the opening 17 on the skin material 15, and both terminals are fixed on the upper position along the partition line P of the molds 22, 23. Any one of the upper parts, 22a, 23a of the molds 22, 23 is made open, and the row liquid of foaming synthetic resin is injected into the gap between the skin material 15 and a frame 12 in the state where the opening 17 is expanded by pushing, and then the opening 17 is closed, and after the molds 22, 23 have been closed, the resin is foamed and cured, whereby the pad 13 is molded integrally with the skin material 15 and the frame 12.
申请公布号 JPH04166305(A) 申请公布日期 1992.06.12
申请号 JP19900293191 申请日期 1990.10.30
申请人 IKEDA BUSSAN CO LTD 发明人 YAGISHITA NORIO
分类号 B68G7/06;B29C39/10;B29C39/22;B29C44/58;B29K105/04;B29L31/58 主分类号 B68G7/06
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