| 摘要 |
PURPOSE:To contrive the multipin formation of a functional circuit module and an increase in the function of the module by a method wherein outer leads for connecting with a mother board are formed on a printed board film having a flexibility and a reinforcing plate is laminated on the part other than the parts, on which the leads are formed, of the printed circuit film. CONSTITUTION:This film is a flexible printed circuit film of a structure, wherein necessary circuit patterns 23 are formed on the surface of an insulating film 22 and outer leads 24 are formed on the rear of the film 22. The patterns 23 are made to have continuity with the leads 24 via through holes 25. A reinforcing plate 26 is laminated on the part other than the parts, on which the leads 24 are formed, of the rear of this printed circuit film 21 via a bonding agent 27. According to this constitution, as the leads 24 for connecting with a mother board 31 are formed on the film 21, it becomes possible to miniaturize the pitch between the leads 24. Thereby, a module, which has a small occupation area and has a multipin and a multifunction, can be constituted. |
