| 摘要 |
PURPOSE:To prevent solder scattering in the case of solder reflow and bonding strength degrading occurring by flux residue, by mounting a glass epoxy substrate for mounting components like a chip capacitor and a mini flat IC, and performing bonding after solder reflow and washing. CONSTITUTION:On a ceramic substrate 1 wherein a thick film pattern is formed, solder paste is printed, components like a chip capacitor and a mini flat IC are mounted, and solder is melted by passing a reflow furnace, thus packaging the chip capacitor, the mini flat IC, etc. The surface of the ceramics substrate 1 is cleaned by flux washing. A semiconductor pellet 2 is fixed by using conductive adhesive agent 3, and at the same time, a glass epoxy substrate 6 is fixed so as to be connected with a conductor pattern 7 on the ceramic substrate 1, by using the conductive adhesive agent. Next the ceramic substrate 1 is heated, and wire bonding is performed with Au wires 8, thereby connecting the semiconductor pellet 2 and a bonding pad 4. |
