| 摘要 |
<p>A finger by which a semiconductor integrated circuit provided with an electrode array of a high density can be mounted on a circuit board easily and safely as conventionally is realized. Further, a conductor pattern by which the mounting density of the integrated circuit can be improved in the case including this finger is also realized. For this purpose, the finger is constituted by a conductor pattern having a multilayer structure. The conductor patern comprises conductive layers and insulating ones isolating the conductive ones. Also, the conductive paths in the direction of thickness for interconnecting the layers can be formed, in addition to the wiring pattern of the finger through which the integrated circuit and the mounting board are connected. Thereby, the circuit board of high mounting density can be realized.</p> |
