发明名称 |
SEMICONDUCTOR PACKAGE |
摘要 |
-37- 18110-MB A semiconductor package for an electrical component has a metal or metal alloy leadframe adapted to have an electrical component connected thereto. The leadframe is bonded by means of a polymer to copper or copper alloy base and cap members. The cap and base members have coated to their inside surfaces a metal or metal alloy which improves the polymer bond. |
申请公布号 |
CA1303251(C) |
申请公布日期 |
1992.06.09 |
申请号 |
CA19880587086 |
申请日期 |
1988.12.28 |
申请人 |
CRANE, JACOB |
发明人 |
CRANE, JACOB;JOHNSON, BARRY C.;MAHULIKAR, DEEPAK;BUTT, SHELDON H. |
分类号 |
H01L23/057;H01L23/06;H01L23/10;H01L23/14;H01L23/367 |
主分类号 |
H01L23/057 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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