发明名称 LIQUID COOLING SYSTEM FOR INTEGRATED CIRCUITS
摘要 LIQUID COOLING SYSTEM FOR INTEGRATED CIRCUITS A leak tolerant cooling system for cooling electrical components with a liquid comprises: a frame 10 holding a plurality of printed circuit boards 11, each of which have electrical components attached thereto; a top reservoir 14, mounted on the frame 10 above the boards, for holding the liquid at atmospheric pressure; a conduit (17a-17g) coupled to the top reservoir and the boards, for conveying the liquid in a downward direction from the top reservoir over the components, the conduit being airtight in the absence of a leak therein; a bottom reservoir 15, coupled to the conduit below the boards, for receiving the liquid plus any air due to leaks from the conduit, the bottom reservoir being airtight except for a valve 16 which opens in response to a valve control signal S2; a pump 19, coupled to the bottom reservoir, for sucking the liquid and air through the conduit at subatmospheric pressures in response to a pump control signal S1, and for simultaneously returning the liquid to the top reservoir; and a control circuit 25 for generating the pump control signal starting when the liquid in the bottom reservoir is at a predetermined high level and continuing until the liquid in the bottom reservoir drops to a predetermined low level due to air leaking into the conduit, and for generating the valve control signal as the complement of the pump control signal.
申请公布号 CA1303249(C) 申请公布日期 1992.06.09
申请号 CA19900615761 申请日期 1990.06.01
申请人 UNISYS CORPORATION 发明人 TUSTANIWSKJ, JERRY I.;HALKOLA, KYLE G.
分类号 H01L23/34;H01L23/40;H01L23/46;H01L23/473;H05K7/20 主分类号 H01L23/34
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