| 摘要 |
PURPOSE:To increase a hardening speed, forming the most suitable guard ring, and make efficient resin sealing possible by, while sealing resin is supplied to the guard ring formation part of a circuit substrate, hardening the sealing resin by heating. CONSTITUTION:A laser irradiation tube 28 to receive laser energy from a laser source 24 as a heating source and produce laser light 26 as heating light is arranged near a syringe 20 as a supplier for sealing resin 16. The light 26 is applied to the resin 16 dropped on to a circuit substrate 2 from a needle 22 and the energy of the light 26 heats to harden the resin 16. That is, the hardening prevents the resin 16 from flowing and a guard ring 18 of sufficient height and strength within narrow ranges is formed. Thereby the ring 18 is made in a short time and hardened immediately to enough strength to fill the resin 16, therefore, the manufacturing time is shortened and manufacturing cost is decreased.
|
