| 摘要 |
PURPOSE:To make it possible to joint directly fine metal wire without plating on the surface of a lead frame by etching the surface of a lead frame assembly formed into a prescribed pattern, by drying after being cleaned, and by packaging. CONSTITUTION:Etching is applied on the surface of a lead frame element assembly which is formed into a prescribed pattern by press casting or other means. Then, the lead frame element assembly is dried after being cleaned, and is packaged. For example, for the lead frame element assembly, the composition of the surface shall be of copper or copper alloys. The above-mentioned etching is applied with the use of etching agent which contain HCl of more than 0.1vol.% in ethanol or methanol. The above-mentioned cleaning is conducted by ultrasonic cleaning in a volatile organic solvent with hydrophilic property. In addition, the above-mentioned packaging is conducted by a method in which the lead frame is housed in a bag-shape film for packaging together with oxygen adsorbent and/or moisture absorbent, and a gas without reacting property to copper at room temperatures is sealed in the film. |
